Note: This is a guest post written by Lorin McDowell
The ZenBook 3 Deluxe UX490UA is lauded as the enhanced version of the original ZenBook, and is the newest star to join ASUS’ “Zennovation” lineup.
Showcased as part of the Taiwan Excellence delegation at the recent CeBIT conference, the model measures a super thin 12.9mm and sports a 14-inch screen.
It includes a new seventh generation Kaby Lake processor from Intel, along with two Type-C ports supporting Thunderbolt 3 at the full 40Gb/s.
Its myriad of premium features represent the next step in operating functionality and design in the highly contested ultra-portable space.
“The realisation of ZenBook 3’s design took some serious engineering prowess and craftsmanship. The ultra-thin 12.9mm profile meant we had to invent the world’s most compact laptop hinge—just 3mm high—to preserve its sleek lines, and the iconic Zen-inspired spun-metal finish on the enclosure is the result of an intensive 40-step process,” says Lorin McDowell, ASUS Systems’ Head of Marketing.
With the integration of the Intel® Core™ i7 processor, up to 512GB PCIe® Gen 3 SSD, the ZenBook 3 is now 20% faster than earlier versions. The all-metal unibody enclosure is moulded from a single sheet of aerospace grade aluminium, resulting in a device that weighs in at just 1.1kg, half the weight of a normal laptop.
The laptop display is covered with full edge-to-edge Corning® Gorilla® Glass 5, which is twice as thin as standard cover glass. The ultra-slim bezel is just 7.46mm wide, enabling an 84% screen-to-body ratio, and the 14″ FHD screen also boasts a 178-degree viewing angle and crisp colour and detail.
ASUS have engineered a new cooling system using state-of-the-art components such as a liquid-crystal-polymer fan impeller that is 0.3mm thick, and a copper-alloy heat pipe with walls measuring just 0.1mm thick.
Overall, the cooling system measures just 3mm high, ensuring no bulk is added to the super-thin laptop, while efficiently pulling heat away from the Intel processor. This innovation routes warm air through hidden vents in the hinge for efficient and quiet cooling, even under full load.
The ZenBook 3 Deluxe’s full size, back-lit keyboard stretches from edge to edge with a 2.1mm bezel at each side and the key pitch (the distance between the centre of each key) is 19.8mm, which is comparable to most desktop keyboards.
The precision touchpad has a glass covering for smooth control, and incorporates palm-rejection technology, all the usual multi-touch gestures, and there is also a fingerprint scanner embedded into the touchpad, allowing users to jump into Windows 10 Pro with just a touch.
Notable too is the ZenBook’s increased audio capability—joining forces with audiophile specialists Harman Kardon, they have created the next generation of ASUS SonicMaster audio technology that includes four separate high-quality speakers, powered by a smart four-channel amplifier. The ZenBook 3 Deluxe also features the latest power-efficient Bluetooth® 4.1 and dual-band 802.11ac Wi-Fi, which is touted as more reliable and three times faster than previous generation 82.11n.
Lorin McDowell, ASUS Systems Head of Marketing says the device combines “expert design and craftsmanship with leading-edge technology to create a truly exceptional ultraportable”.
It looks like the industry agrees—the ZenBook 3 Deluxe has been met with a warm reception from consumers and has built on the success of the ZenBook 3, which won a collection of design awards, including the 2016 Computex d&i Award, 2016 Good Design Award, 2017 CES Innovation Award, 2017 iF design Award, and 2016 Computex Best Choice Award.
Its feather light, sleek design coupled with its abundant start-of-the-art technical inclusions makes this device one to get excited about.